Fully Customized FPC CablesMany sectors including consumer electronics, medical devices, and industrial equipment have unique connection requirements that off‑the‑shelf standard FPC flexible cables cannot satisfy. For these demanding projects, a fully customized FPC solution becomes essential, and this is where DonvisTek stands out as a professional OEM & ODM FPC manufacturer. You can send detailed specifications such as layer count, thickness, pin count, bending requirements or application, our engineer team will quickly provide you with the most professional flexible circuit solutions. Or simply provide your ideas, we will complete the FPC layout design, Gerber file optimization, custom stencil development and prototype sample production for you.
Custom 1-layer, 2-layer, 4-layer, 6-layer, 8-layer FPC flexible circuits, single-sided / double-sided / multi-layer structure according to your project needs.
Custom length available from 5mm-1000mm. Width range: 1.5mm‑120mm, including ultra‑narrow micro‑FPC and wide‑format large‑size FPC cables.
0.05mm / 0.08mm / 0.1mm / 0.15mm / 0.2mm / 0.3mm options for ultra‑thin, standard and heavy‑duty applications.
2‑120 pins, both odd‑pin and even‑pin layouts can be manufactured to your requirements.
0.3mm / 0.5mm / 0.8mm / 1.0mm / 1.25‑mm standard pitch sizes for FPC & flat cables.
ZIF socket, Type‑C male / female, gold finger, board‑to‑board connector, soldering terminal. Single‑end crimp, dual‑end crimp, bare gold‑finger without connector.
Straight, L‑shape, U‑shape, irregular cutout, pre‑formed bending profile for tight‑fit installation.
Positioning holes, notches and alignment slots, enabling quick and precise housing assembly.
| Treatment Type | Specification & Application |
|---|---|
| Thin gold plating (0.03‑0.05μm) | Standard signal transmission, cost‑effective |
| Thick gold plating (0.1μm‑0.3μm) | Heavy‑duty plug‑and‑play, industrial & automotive applications |
| Tin plating | Tinned soldering pads for easy welding |
| Edge plating | Side sealing to avoid copper oxidation and delamination |
| OSP surface finish | Low‑cost anti‑oxidation treatment for soldering pads only |
| Performance Item | Options & Description |
|---|---|
| Current & Voltage | Low‑current signal circuit / high‑current power circuit with customized trace width |
| Impedance Control | 90Ω / 100Ω differential impedance for high‑speed signals (USB, HDMI, MIPI, display & camera modules) |
| EMI Shielding | Conductive shielding film & grounding design, anti‑interference for display, POS, printer and automotive devices |
| Bending‑Standard | Hundreds of cycles for consumer electronics |
| High‑flex Bending | ≥10,000 cycles for printer mechanisms and rotating‑shaft equipment |
| Standard Temperature | ‑40℃ ~ +85℃ |
| Automotive‑grade Temperature | ‑40℃ ~ +125℃ |
| Custom Process | Description |
|---|---|
| Embossing | Emboss customer logo or part number on cable surface |
| Hot‑press forming | Pre‑bent profile for simple assembly |
| Double‑sided & Multi‑layer FPC | Complex multi‑layer flexible circuit design |
| Peel‑off protective film | Pre‑applied protective film for circuit protection during assembly |
